IME Probes
The graphic to the left illustrates the high level packaging of IMEs to allow then to be used as probes.
- A 1.0 cm wide x 6.5 cm long printed circuit board (PCB) has been fabricated to extend the leads of the IME.
- The IME chip is bonded to the chip seat ledge of the PCB.
- Highly conductive Ag-epoxy paste is used to establish electrical contact between the PCB and the IME chip bonding pads.
- Pin-headers are placed on the distal end of the PCB.
- An encapsulating shroud of epoxy-lined PTFE is heat-shrunk around the PCB and the bonding pad region is encapsulated in a chemically resistant, high performance epoxy.